Traditional cleaning methods often rely on aggressive chemicals like sulfuric acid or hydrogen peroxide. While effective, these substances create significant disposal costs and environmental burdens. Ozone technology offers a superior path forward.
Superior Oxidation Power
Ozone possesses a higher oxidation potential than most liquid chemicals. This allows for the rapid removal of photoresist residues and organic impurities without damaging the underlying silicon substrate. For advanced logic and memory chips, this level of control is vital to maintain structural integrity.
Significant Chemical Reduction
By switching to an ozone based process, fabs can drastically reduce their consumption of hazardous chemicals. This leads to lower procurement costs and simplified waste management protocols. Our systems align perfectly with the growing demand for green fab solutions and sustainable manufacturing practices.
Enhanced Surface Wetting
Ozone treatment modifies the surface energy of the wafer. This improvement in wettability ensures that subsequent processing steps like Atomic Layer Deposition (ALD) or Chemical Vapor Deposition (CVD) result in more uniform and defect free films.
Core Applications of Ozone Gas Generators
Our Ozone Gas Generators are versatile tools designed for multiple stages of the front end and back end manufacturing process.
1. Semiconductor Wafer Cleaning
In the cleaning phase, ozone gas is used to strip organic contaminants. When integrated into an Ozone Water System, it creates ozonated DI water (DIO3) which is the gold standard for removing metallic impurities and organic particles. This process is essential after ion implantation and before critical lithography steps.
2. Thin Film Oxidation and ALD
As devices shrink, the quality of the oxide layer becomes a primary performance driver. Our generators provide the high concentration ozone required for high k dielectric growth and surface passivation. The stability of our gas output ensures that film thickness remains consistent across the entire wafer surface.
3. Photoresist Stripping (Ashing)
Ozone is an excellent agent for dry ashing processes. It efficiently breaks the carbon bonds in photoresist materials and converts them into volatile gases like CO2. This method is much gentler on the wafer compared to plasma based ashing which can sometimes cause charge induced damage to sensitive circuits.
| Feature | Specification Detail |
|---|---|
| Ozone Concentration | Up to 400 g/Nm3 (High Concentration Models) |
| Gas Purity | 99.999% Ultra High Purity Output |
| Flow Rate Control | Precision Mass Flow Controllers (MFC) integrated |
| Cooling System | Integrated water cooled electrodes for thermal stability |
| Interface | Full PLC integration with SECS/GEM compatibility |
Innovative Cell Design
Our generators utilize advanced dielectric materials and high frequency power supplies. This combination maximizes ozone production efficiency while minimizing the generation of heat. High heat is the primary enemy of ozone stability. By keeping the reaction chamber cool, we ensure that the O3 does not decompose back into O2 before it reaches the process chamber.
Safety and Monitoring
Safety is our priority. Every unit is equipped with redundant leak detection sensors and automatic shut off valves. We also provide real time ozone concentration monitors that feed data directly into your fab central control system. This allows for closed loop process control and immediate troubleshooting.
Integration with the Inquivix Ecosystem
An Ozone Gas Generator is most effective when it is part of a holistic clean process strategy. At Inquivix Technologies, we specialize in integrating these units with other critical systems to create a unified production environment.
Ultrapure Water Integration
To create effective cleaning solutions, the ozone must be dissolved into water of the highest quality. Explore our [Ultrapure Water System] to see how we ensure the carrier fluid is free of all ions and particulates.
Hydrogen Process Synergy
Some advanced cleaning steps require a transition from an oxidizing environment to a reducing one. Our [Hydrogen Gas Generator] works in tandem with ozone systems to provide complete surface conditioning.
Custom Integration Services
We do not just sell hardware. We provide the engineering expertise to integrate these systems into your existing wet benches or atmospheric chambers.
1. Reduce the carbon footprint associated with chemical transport and disposal.
2. Lower water consumption by reducing the need for extensive rinsing steps.
3. Improve the overall Safety Data Sheet (SDS) profile of your fabrication plant.
For more details on how we help partners achieve their green targets, visit our ESG and Sustainability Page.
Strategic Partnership for the Korean Market
Inquivix Technologies serves as the vital link between global technology innovators and the robust Korean semiconductor industry. We understand the unique requirements of local fabs and the importance of rapid technical support.
As a leading semiconductor distributor in Korea, we provide:
Our role is to ensure that your ozone oxidation system in Korea operates at peak performance from day one. We bridge the gap between complex engineering and practical fab floor application.
As the industry transitions toward 3nm and 2nm logic nodes, the sensitivity of the wafer surface reaches an all time high. Traditional wet cleaning using NH4OH, H2O2, and HCl (RCA clean) can sometimes lead to excessive etching or roughening of the silicon surface. This is where ozone gas generation provides a distinct advantage.
Surface Passivation and Interface Quality
In Gate All Around (GAA) architectures, the interface between the channel and the gate dielectric is critical. Ozone provides a high quality, low defect density chemical oxide. This thin layer serves as a foundation for high k materials. By controlling the concentration of the ozone gas, engineers can tune the thickness of this interface layer with angstrom level precision.
Back End of Line (BEOL) Cleaning
In the BEOL stages, where copper interconnects and low k dielectrics are present, traditional chemicals can cause corrosion or dielectric constant shifting. Ozone is a much more compatible agent for cleaning organic residues from these sensitive structures. It ensures that the vias and trenches are perfectly clean before metal deposition.
One of the most critical steps in wafer fabrication is photoresist stripping. As circuit patterns become smaller, the methods used to remove the “mask” must become more precise. An ozone oxidation system Korea fabs utilize often focuses on this specific application. Ozone-based stripping is a dry or “semi-dry” process that prevents the physical damage often caused by aggressive plasma etching or mechanical scrubbing.
The Mechanics of Ozone Oxidation in Stripping
The process involves exposing the wafer surface to high concentrations of ozone gas. The ozone reacts with the photoresist material, breaking the chemical bonds that hold the polymer together. Because ozone is a gas, it can penetrate deep into the narrow trenches and vias of a complex semiconductor architecture. This ensures that no resist residue is left behind, which is vital for the integrity of subsequent layers.
Using an ozone generator wafer cleaning setup for stripping also minimizes the risk of metal contamination. Traditional liquid strippers can sometimes introduce trace metal ions that ruin the electrical properties of the chip. Ozone, produced from ultra-pure oxygen, remains free of these contaminants. This level of purity is why leading semiconductor manufacturers in Korea and beyond are investing heavily in advanced ozone delivery modules.
Safety and integration are paramount when installing an industrial ozone gas generator within a cleanroom environment. Ozone is a powerful oxidant, so the delivery system must be constructed from materials that are resistant to corrosion. High-grade stainless steel and specialized fluoropolymers are typically used to ensure the longevity of the equipment and the purity of the gas.
Reliability and Maintenance in High-Volume Fabs
A cleanroom ozone system must operate with nearly 100% uptime. In a high-volume manufacturing environment, any downtime can result in millions of dollars in lost revenue. Therefore, modern generators are built with redundant power supplies and modular cells. If one cell requires maintenance, the others can continue to operate, ensuring a constant supply of ozone to the tools.
The monitoring systems integrated into these generators track gas flow, pressure, and concentration in real time. This data is fed back into the fab’s central control system. By using advanced sensors, engineers can predict when a component is nearing the end of its life. This proactive approach to maintenance is what separates top-tier ozone oxidation system Korea suppliers from the competition.
Transform Your Fab Efficiency with Precision Ozone Engineering
Are you ready to optimize your cleaning and oxidation processes with the latest ozone technology? Inquivix Technologies is here to help you select the right system for your specific application requirements. Whether you are designing a new facility or upgrading an existing line, our team of experts will provide the technical data and integration support you need. We are the trusted partner for semiconductor cleaning technology in Korea.